Sireda Technology Co., Ltd.  

Product Name: F Solution, BGA137 Mcp Test Socket_11.5X13mm with F Interposer, Compatible Bag137 Test Kit, Removable Lid Model NO.: 702-0000286 Pitch: 0.8mm Pin Count: 137 IC Size: 11.5X13mm Strcture: Dt Removable Package: BGA Contact: Spring Probe Trademark: Sireda Transport Package: Carton Box Specification: BGA137 MCP 11.5X13mm Origin: Shenzhen, China HS Code: 8536690000 Product Description F solution -BGA1367 MCP Test Socket /Test Kit with Finterposer-Fsolution is designed to avoid problems of pad co-planarity, oxidation and damage of PCB board after de- soldering.-This solution is patented.-The compact, surface mount design requires no tooling, no extra place or mounting holess in the target PC board.-Precision machined spring probes with industry proven solder balls ensure high reliability performance, easy maintenance.-Fully removable double latch turning lid is good for both manual and automatic operation.-Size:11.5X13mm, 10.5X13mm.MechanicalMaterial Socket Body: PEEK CeramicMaterial Socket Lid: AL, Cu, POMContact: Pogo PinOperation Temperature: -40 ~120 ºCLife Span: 50K CyclesSpring Force: 20g ~30g per PinSolder Ball: 96.5Sn/3.0Ag/0.5Cu (SAC305)ElectricalCurrent Rating: Min.1.2ADC Resistance: Max. 100mΩWe provide products with good quality and fast response, also provide customized service. If you like to learn more about us, please have alook at our website:www.sireda.com.