Sireda Technology Co., Ltd.  

Product Name: Emcp 221 Test Socket_11.5X13mm with SD Adapter Model NO.: 702-0000899 IC Size: 11.5X13mm Pin: 221 Structure: Clamshell Package: BGA Contact: Spring Probe Trademark: Sireda Transport Package: Carton Box Specification: eMCP BGA221 11.5x13mm Origin: Shenzhen, China HS Code: 8536690000 Product Description SD solution, eMMCP BGA221 test adapter to SD Card /SD AdapterSD solution is designed for test, debug, validation, and programming of eMMC, eMCP devices.Provides acompact test solution for eMMC, eMCP devices used in applications such as handheld, mobile, and TV product development.Applicable for eMMC,eMCP devices from Samsung, Hynix, Sandisk, Toshiba, Kingston, Intel,etc, including BGA100, BGA136, BGA153, BGA169, BGA162, BGA186, BGA221, BGA254, BGA280, BGA529.Support for eMMC version 5.0 or above.Chip-off IC devices failure analysis, real time write-and-read in forensic application.Support for hot plug, eMMC/eMCP can be directly connected to PC with SD Card orSD adapter.This model 702-0000899 is forIC chip with solder ball, if you need to test IC chip without solder ball, please contact us.MechanicalMaterial Socket Body: PPSMaterial Socket Lid: AL, POMContact: Pogo PinOperation Temperature: 0 ~80 ºCLife Span: 30 KCyclesSpring Force: 20g ~30g per PinElectricalCurrent Rating: 1.5ADC Resistance: <100mΩ@0.65mmWe provide alarge range of customized socket, if you have special requirement or want to learn more about us, please search our websitewww.sireda.com..