Sireda Technology Co., Ltd.  

Product Name: Emmc BGA153 with Balls Test Socket with SD Adapter Model NO.: 702-0000848 Condition: New Customized: Non-Customized Certification: ISO9001 Color: Red/Black IP Rating: No Cable Length: No Hole-Digit: No Application: Industrial Type: Without Switch Grounding: Non-Grounding Contact: Pogo-Pin IC Size: 11.5X13mm Pin: 153 or 169 Structure: Clamshell Package: BGA Trademark: Sireda Transport Package: Carton Box Specification: eMMC BGA153 11.5x13mm Origin: Shenzhen China HS Code: 8536690000 Product Description SD solution, eMMC BGA153 test adapter to SD Card /SD AdapterFeaturesSD solution is designed for test, debug, validation, and programming of eMMC, eMCP devices.Provides acompact test solution for eMMC devices used in applications such as handheld, mobile, and TV product development.Support for eMMC version 5.0 or above.Chip-off IC devices failure analysis, real time write-and-read in forensic application.Support for hot plug, eMMC can be directly connected to PC with SD Card orSD adapter.This model 702-0000848 is forIC chip with solder ball, if you need to test IC chip without solder ball, please contact us.This adapter is for testingIC with solder balls, if you want to test IC without solder balls, please search for other product or send us message.Other IC size like below,please let us know before ordering.11x10mm11.5x13mm12x16mm12x18mm14x18mm MechanicalMaterial Socket BodyPPSMaterial Socket LidAL, POMContactPogo PinOperation Temperature0 ~80 ºCLife Span30 KCyclesSpring Force20g ~30g per PinElectricalCurrent Rating1.5ADC Resistance<100mΩ@0.65mmOur servicesWe provide alarge range of customized sockets. If you have special requirement or want to learn more about us, please have a look at our website www.sireda.com