Sireda Technology Co., Ltd.  

Product Name: F1 Solution, BGA153 Ufs Test Socket_11.5X13mm with F1 Interposer, Test Fixture, Compatible Bag153, Removable Lid, with Pinout, Mini Socket Model NO.: 702-0000953 Pitch: 0.5mm Pin Count: 153 Chip Size: 11.5X13mm Structure: Dt Removalbe Package: BGA Contact: Spring Probe Trademark: Sireda Transport Package: Carton Box Specification: UFS BGA153 11.5x13mm Origin: Shenzhen, China HS Code: 8536690000 Product Description F1 solution -UFS BGA153 Test Socket with F1 interposer-F1solution is designed to avoid problems of pad co-planarity, oxidation and damage of PCB board after de- soldering.-This solution is patented.-The compact, surface mount design requires no tooling, no extra place or mounting holess in the target PC board.-Precision machined spring probes with industry proven solder balls ensure high reliability performance, easy maintenance.-Fully removable double latch turning lid is good for both manual and automatic operation.-Pinoutfor extra test or monitoring.-Mini socket sizes similar to IC chip size.MechanicalMaterial Socket BodyPEEK CeramicMaterial Socket LidAL, Cu, POMContactPogo PinOperation Temperature-40 ~120 ºCLife Span50K CyclesSpring Force20g ~30g per PinSolder Ball96.5Sn/3.0Ag/0.5Cu (SAC305)ElectricalCurrent RatingMin.1.2ADC ResistanceMax. 100mΩWe provide products with good quality and fast response, also provide customized service. If you like to learn more about us, please have alook at our website:www.sireda.com..